Key Features of D&D Probe Cards for Wafer Sorting:

  • Technology:
    • Epoxy Card
    • Blade Card
  • TINY FINE PAD:2 MILS
  • Multiple Tiers: 4 Tiers
  • High Pin Count: UP TO 500+
  • Fine Pitch Pad: 2.9 MILS
  • Multiple Dice
    • Dual Die (Horizontal; Diagonal)
    • Quad Die (Horizontal; Diagonal)
    • 32 Dice
  • X-Y Coordinate
  • Wafer:
    • Ceramic
    • Gold Bump (1 MIL HEIGHT)
    • Solder Bump (17 MIL HEIGHT)
  • Tip Angle: 103 TO 106 DEGREES
  • Needles
    • W (TUNGSTEN)
    • WR (TUNGSTEN RHENIUM)
    • P (PALANEY)
    • BeCu (BERYLLIUM COPPER)
    • Coaxial Wire
  • Tip Length: 7 TO 100 MILS
  • TIP Diameter: 1/2 TO 10 MILS
  • Wire Size: 5-15 MILS
  • Die Size: 20 MILS –3 INCHES
  • TEMPERATURE: +25 TO +125 DEGREES
  • High Frequency: Up To 4 GHZ
  • High Current
  • Low Capacitance
  • Low Leakage
  • Low Contact Resistance
  • Control Impedence
  • Assembly DUT Boards
  • Load Boards
  • Universal Boards
  • Custom Boards
  • Parts For all Probe Card Needs