Key Features of D&D Probe Cards for Wafer Sorting:
- Technology:
- Epoxy Card
- Blade Card
- TINY FINE PAD:2 MILS
- Multiple Tiers: 4 Tiers
- High Pin Count: UP TO 500+
- Fine Pitch Pad: 2.9 MILS
- Multiple Dice
- Dual Die (Horizontal; Diagonal)
- Quad Die (Horizontal; Diagonal)
- 32 Dice
- X-Y Coordinate
- Wafer:
- Ceramic
- Gold Bump (1 MIL HEIGHT)
- Solder Bump (17 MIL HEIGHT)
- Tip Angle: 103 TO 106 DEGREES
- Needles
- W (TUNGSTEN)
- WR (TUNGSTEN RHENIUM)
- P (PALANEY)
- BeCu (BERYLLIUM COPPER)
- Coaxial Wire
- Tip Length: 7 TO 100 MILS
- TIP Diameter: 1/2 TO 10 MILS
- Wire Size: 5-15 MILS
- Die Size: 20 MILS –3 INCHES
- TEMPERATURE: +25 TO +125 DEGREES
- High Frequency: Up To 4 GHZ
- High Current
- Low Capacitance
- Low Leakage
- Low Contact Resistance
- Control Impedence
- Assembly DUT Boards
- Load Boards
- Universal Boards
- Custom Boards
- Parts For all Probe Card Needs