Key Features of D&D Probe Cards for Wafer Sorting:

• Technology:
  • Epoxy Card
  • Blade Card
• TINY FINE PAD:2 MILS 
• Multiple Tiers:  4 Tiers
• High Pin Count: UP TO 500+
• Fine Pitch Pad:  2.9 MILS
• Multiple Dice
  • Dual Die (Horizontal; Diagonal)
  • Quad Die (Horizontal; Diagonal)
  • 32 Dice
• X-Y Coordinate
• Wafer:
  • Ceramic
  • Gold Bump (1 MIL HEIGHT)
  • Solder Bump (17 MIL HEIGHT)
• Tip Angle: 103 TO 106 DEGREES
• Needles
  • W (TUNGSTEN)
  • WR (TUNGSTEN RHENIUM)
  • P (PALANEY)
  • BeCu (BERYLLIUM COPPER)
  • Coaxial Wire
• Tip Length:  7 TO 100 MILS
• TIP Diameter: 1/2 TO 10 MILS
• Wire Size: 5-15 MILS
• Die Size: 20 MILS –3 INCHES
• TEMPERATURE:  +25  TO +125 DEGREES
• High Frequency:  Up To 4 GHZ
• High Current
• Low Capacitance
• Low Leakage
• Low Contact Resistance
• Control Impedence
• Assembly DUT Boards
• Load Boards
• Universal Boards
• Custom Boards
• Parts For all Probe Card Needs